A self-etch, dual cured adhesive.
Suitable for all light-cured, dual-cured and self-cured resins.
Over 30 MPa adhesion to dentine and enamel with light-cure composites and strong bond strength with dual-cure and self-cure composites.
Virtually no post-operative sensitivities.
Can be used without light, therefore great for endo.
Reinforced with nano particles: increased bonding values, increased marginal integrity.
Fast and easy one-coat application (apply, dry, and cure in 35 sec).
Moisture tolerant.
No refrigeration or shaking necessary.
Contains fluoride.
